Cooling unit and electronic apparatus system

ABSTRACT

A cooling unit includes a cooling member cooled by a cooling body, a plurality of heat transfer members, and a support member. Each of the plurality of heat transfer members has a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled. The support member supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2011-060010, filed on Mar. 18, 2011, the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to a cooling unit and an electronic apparatus system.

BACKGROUND

A conventional known heat transfer interface system has a plurality of pins and a heat transfer body having a plurality of holes into which the plurality of pins are inserted; to transfer heat from a target to be cooled, the plurality of pins are placed in tight contact with the target so as to follow its shape. Japanese Laid-open Patent Publication Nos. 2003-243583, 6-283874, and Japanese Unexamined Utility Model Registration Application Publication No. 6-81024 are examples of related art.

When a cooling body is used in this heat transfer interface system to cool the target, however, the plurality of pins are typically placed in a state in which heat can be transferred between the pins and the heat transfer body regardless of whether the pins are in tight contact with the target. Accordingly, if some of the pins are in contact with the target and the other pins are not in contact with the target, the pins not in contact with the target are cooled through the heat transfer body, resulting in the risk of these pins causing dew condensation.

SUMMARY

According to an aspect of the invention, a cooling unit includes a cooling member cooled by a cooling body, a plurality of heat transfer members, each of the plurality of heat transfer members having a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled, and a support member that supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.

The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross sectional view illustrating a cooling unit in an embodiment;

FIG. 2 illustrates a state in which the cooling unit in FIG. 1 is used to cool an electronic apparatus;

FIG. 3 is an enlarged view of the major elements in FIG. 2;

FIG. 4 is a first variation of the cooling unit;

FIG. 5 is a second variation of the cooling unit;

FIG. 6 is a third variation of the cooling unit;

FIG. 7 illustrates a state in which the cooling unit in FIG. 6 is used to cool an electronic apparatus;

FIG. 8 is an overall view of an electronic apparatus system in an embodiment;

FIG. 9 is a variation of the electronic apparatus system;

FIGS. 10A to 10D illustrate examples of the placement of a plurality of heat dissipating blocks.

DESCRIPTION OF EMBODIMENTS

Embodiments of the technology in the present disclosure will be described below in detail with reference to the drawings.

A cooling unit 10 according to an embodiment includes a cooling member 12, a plurality of heat transfer members 14, a heat insulating member 16, and a support member 18, as illustrated in FIGS. 1 and 2.

The cooling member 12 is formed in a planular shape. A cooling pipe 20 passes through the interior of the cooling member 12. The cooling member 12 and cooling pipe 20 have heat a transfer property. The cooling pipe 20, which is serpentine, is connected to a coolant supply unit (not illustrated) that supplies a coolant 22, which is an example of the cooling body. When the coolant 22 supplied from the coolant supply unit connected to the cooling pipe 20 passes through the cooling pipe 20, the cooling member 12 is cooled by the coolant 22. Out of a plurality of surfaces of the cooling member 12 shaped like a box, a surface facing the plurality of heat transfer members 14, described later, is referred to as a cooling surface 12A, which is brought into contact with the plurality of heat transfer members 14.

Each of the plurality of heat transfer members 14 is formed in a block shape and is made of a transcalent material having a transfer property. The heat transfer members 14 are arranged in a matrix form in plan view. Each heat transfer member 14 is made movable toward and away from the cooling surface 12A by being elastically supported by the support member 18 described later. The surface, of the heat transfer member 14, that faces the cooling surface 12A is referred to as a first contact member 14A, which is brought into contact with the cooling surface 12A. The surface opposite to the cooling surface 12A is referred to as a second contact member 14B, which is brought into contact with an electronic apparatus 38, which is an example of the target to be cooled.

Each of the heat transfer members 14 is separated from the cooling surface 12A in the direction of the normal to the cooling surface 12A by being elastically supported by the relevant support member 18. That is, with the heat transfer member 14 not pressed toward the cooling surface 12A, a spacing 24 is obtained between the heat transfer member 14 and the cooling surface 12A by an elastic force of the support member 18.

The heat insulating member 16 includes an insulating case 26 and an insulating layer 28, which are both thermally insulative. The insulating case 26, formed in a box shape, accommodates the cooling member 12. The insulating case 26 has a bottom 26A, at which the cooling member 12 is secured, and also includes a ceiling 26B facing the bottom 26A. The ceiling 26B is separated from the cooling surface 12A in the direction of the normal to the cooling surface 12A.

The ceiling 26B has a hole 30 passing through it in a direction in which the plurality of heat transfer members 14 move toward and away from the cooling surface 12A, that is, in the direction of the normal to the cooling surface 12A. The plurality of heat transfer members 14 described above are placed inside the outer edge of the hole 30.

The insulating layer 28, which is formed in a plate form or sheet form, is overlaid on the cooling surface 12A. The size and shape of the insulating layer 28 are such that the insulating layer 28 substantially covers the entire cooling surface 12A. The insulating layer 28 has through-holes 32, each of which extends in the direction of the normal to the cooling surface 12A, at positions corresponding to the heat transfer members 14 described later. The size and shape of the through-hole 32 are such that a portion of the relevant heat transfer member 14 on the same side as the first contact member 14A can be inserted into the through-hole 32. The insulating layer 28 thermally insulates the cooling member 12 together with the insulating case 26.

The support member 18 has a plurality of insulation support bodies 34, which are thermally insulative and elastic. Each insulation support body 34 is cylindrically shaped so as to enclose the circumference of the relevant through-hole 32 and extends from the insulating layer 28 in the direction of the normal to the cooling surface 12A.

Each of the plurality of the heat transfer members 14 described above has a main body 14C, on which the first contact member 14A is formed, and also includes a stopping member 14D, on which the second contact member 14B is formed, as illustrated in FIG. 3. The stopping member 14D has a larger diameter than the main body 14C. The main body 14C of each heat transfer member 14 is inserted into the relevant insulation support body 34, which is cylindrically shaped as described above. An end of the insulation support body 34 is joined to the stopping member 14D of the heat transfer member 14, and the heat transfer member 14 is thereby elastically supported by the insulation support body 34.

The plurality of insulation support bodies 34 are formed independently of one another, and the plurality of heat transfer members 14 are thereby can move toward and away from the cooling surface 12A independently of one another. That is, the plurality of heat transfer members 14 can move toward and away from the cooling surface 12A independently of positions apart from the cooling surface 12A and position in touch with the cooling surface 12A.

Each of the plurality of insulation support bodies 34, which are cylindrically shaped, individually forms a sealed spacing 36 between the cooling surface 12A and one of the plurality of heat transfer members 14. A plurality of sealed spacings 36 are formed independently of one another.

With the cooling unit 10 structured as described above, when the electronic apparatus 38 having an internal heat generating body is pressed toward the cooling surface 12A with the electronic apparatus 38 in contact with the first contact members 14A of some of the plurality of heat transfer members 14, the second contact members 14B of the some heat transfer members 14 come in contact with the cooling surface 12A, as illustrated in FIG. 2. The heat of the electronic apparatus 38 is then absorbed by the cooling member 12 through the some heat transfer members 14, cooling the electronic apparatus 38. At that time, the heat transfer members 14 not in contact with the electronic apparatus 38 are kept separated from the cooling surface 12A in the direction of the normal to the cooling surface 12A, due to the elastic force of the relevant insulation support bodies 34.

Although not illustrated, if the size and shape of the electronic apparatus 38 are such that the electronic apparatus 38 comes into contact with all of the plurality of heat transfer members 14, the second contact members 14B of all the heat transfer members 14 come into contact with the cooling surface 12A. Accordingly, the heat of the electronic apparatus 38 is absorbed by the cooling member 12 through all the heat transfer members 14, cooling the electronic apparatus 38.

As described above, the cooling unit 10 has a function that can cool the electronic apparatus 38 by adapting to the variable shape and size of the electronic apparatus 38.

Next, the effects and advantages of the cooling unit 10 will be described.

The cooling unit 10 can cool the electronic apparatus 38 regardless of whether the electronic apparatus 38 comes into contact with all or some of the plurality of heat transfer members 14.

With this cooling unit 10, the heat transfer members 14 that are not in contact with the electronic apparatus 38 are kept apart from the cooling member 12. Therefore, this can suppress dew condensation on these heat transfer members 14 and cold air leakage through the heat transfer members 14, that is, a wasteful heat flow.

The cooling member 12 is thermally isolated by being covered with the insulating case 26 and insulating layer 28, which are both thermally insulative. Therefore, this can also suppress cold air leakage from the cooling member 12, suppressing a wasteful heat flow. Accordingly, loss in energy used to cool the cooling member 12 can be suppressed.

Each of the plurality of insulation support bodies 34 not only forms the sealed spacing 36 between the cooling surface 12A and the relevant heat transfer member 14 as illustrated in FIG. 3 but also is thermally insulative. This more ensures thermal isolation for the cooling member 12. Particularly, since the sealed spacings 36 are formed independently of one another, thermal insulation is additionally ensured for the cooling member 12. In addition to the function of elastically supporting the plurality of heat transfer members 14, the plurality of insulation support bodies 34 have the function of thermally insulating the cooling member 12. Therefore, the structure of the cooling unit 10 can be simplified in comparison with a case in which the function of elastically supporting the plurality of heat transfer members 14 and the function of thermally insulating the cooling member 12 are achieved with different structures.

With the plurality of heat transfer members 14 being apart from the cooling surface 12A, the heat transfer members 14 are placed inside the outer edge of the hole 30, as illustrated in FIG. 1. Even if the cold air leaks from each insulation support body 34 or the insulating layer 28, the plurality of heat transfer members 14 can suppress the cold air from leaking from the hole 30.

When thermal isolation is ensured for the cooling member 12 by forming the sealed spacings 36 and placing the plurality of heat transfer members 14 inside the outer edge of the hole 30 as described above, it is desirable for the cooling unit 10 to be operable to suppress dew condensation on the plurality of heat transfer members 14. Dew condensation on the plurality of heat transfer members 14 can then be suppressed by appropriately setting the size of the spacing 24, the insulation performance of the insulation support body 34, the spacing between the outer edge of the hole 30 and each heat transfer member 14, and the like. Thus, it becomes possible not only to ensure heat isolation for the cooling member 12 but also to suppress dew condensation on the plurality of heat transfer members 14.

Next, variations of the cooling unit 10 will be described.

Although the plurality of insulation support bodies 34 of the cooling unit 10 have been each cylindrically formed, this is not a limitation. The insulation support body 34 may be formed as in a variation illustrated in FIG. 4, that is, the insulation support body 34 may be formed in a dome shape expanding from the insulating layer 28 so as to enclose the circumference of the through-hole 32.

A through-hole 42 is formed at the top of each insulation support body 34 coaxially with the relevant through-hole 32. The main body 14C of the heat transfer member 14 passes through the through-hole 42. The top of the insulation support body 34 is secured to the main body 14C. Thus, the plurality of heat transfer members 14 are elastically supported by the plurality of insulation support bodies 34 and are made movable toward and away from the cooling surface 12A independently of one another.

Each of the plurality of insulation support bodies 34 formed in a dome shape individually forms the sealed spacing 36 between the cooling surface 12A and the relevant insulation support body 34.

In this variation, a guide member 44 is disposed opposite to the insulating layer 28 relative to the plurality of insulation support bodies 34. The guide member 44 has a plurality of guide holes 46, each of which is coaxial with the relevant through-hole 42. Each heat transfer member 14 is movably guided by the guide member 44 in the direction of the normal to the cooling surface 12A, with the main body 14C inserted into the guide hole 46.

In this structure as well, the same effects and advantages as in the embodiment described above are obtained.

The support member 18 may be structured as in the variation illustrated in FIG. 5, in which the support member 18 has a sheet of insulation support body 54 that is thermally insulative and elastic. The insulation support body 54 is disposed on a side, of the insulating layer 28, which is opposite to the cooling surface 12A, at a distance from the insulating layer 28. The end of the insulation support body 54 is secured to the outer edge of the hole 30, so a fixed tension is applied to the insulation support body 54.

A support net 56 is provided between the insulation support body 54 and the insulating layer 28 at a distance from the insulating layer 28. The end of the support net 56 is secured to the outer edge of the hole 30. The insulation support body 54 is supported by the support net 56 from the same side as the insulating layer 28.

A plurality of through-holes 62 are formed in the insulation support body 54, each of which is coaxial with the relevant through-hole 32. The main body 14C of the heat transfer member 14 passes through the through-hole 62. The stopping member 14D of each heat transfer member 14 is joined to the outer edge of the relevant through-hole 62, and the heat transfer member 14 is thereby elastically supported by the insulation support body 54. When the insulation support body 54 is elastically deformed, the plurality of heat transfer members 14 move toward and away from the cooling surface 12A independently of one another.

The sheet of insulation support body 54 covers the hole 30, and forms a sealed spacing 66 between the cooling surface 12A and the plurality of heat transfer members 14 together with the insulating case 26.

In a case as well in which the support member 18 has the insulation support body 54 as described above, the following effects and advantages are obtained.

That is, the insulation support body 54 not only forms the sealed spacing 66 between the cooling surface 12A and the plurality of heat transfer members 14 but also is thermally insulative. This ensures thermal isolation for the cooling member 12. In addition to the function of elastically supporting the plurality of heat transfer members 14, the insulation support body 54 has the function of thermally isolating the cooling member 12. Therefore, the structure of the cooling unit 10 can be simplified in comparison with a case in which the function of elastically supporting the plurality of heat transfer members 14 and the function of thermally insulating the cooling member 12 are achieved with different structures. Furthermore, since the insulation support body 54 forms the sealed spacing 66 as a single sealed spacing between the cooling surface 12A and the plurality of heat transfer members 14, the structure of the cooling unit 10 can be more simplified.

When the insulation support body 54 is used to ensure thermal isolation for the cooling member 12 as in this variation, it is desirable for the cooling unit 10 to be operable to suppress dew condensation on the plurality of heat transfer members 14. Dew condensation on the plurality of heat transfer members 14 can then be suppressed by appropriately setting the size of the spacing 24, the insulation performance of the insulation support body 54, and the like.

The cooling unit 10 may be structured as in the variation illustrated in FIGS. 6 and 7, in which the cooling unit 10 has a support member 68, which is insulative and has a hollow. The support member 68 accommodates the cooling member 12 and thermally isolates it.

The support member 68 also has a support wall 68A at a distance from the cooling surface 12A in the direction of the normal to the cooling surface 12A. The support wall 68A is elastic and thereby elastically supports the plurality of heat transfer members 14 described above. Therefore, the plurality of heat transfer members 14 can be moved toward and away from the cooling surface 12A independently of one another.

The support member 68 forms a sealed spacing 76 between the cooling surface 12A and the plurality of heat transfer members 14.

In this variation, in addition to the function of elastically supporting the plurality of heat transfer members 14, the support member 68 has the function of thermally insulating the cooling member 12. Therefore, the structure of the cooling unit 10 can be simplified. The support member 68 not only forms the sealed spacing 76 between the cooling surface 12A and the plurality of heat transfer members 14 but also is thermally insulative. This ensures thermal isolation for the cooling member 12.

In this variation as well, it is desirable for the cooling unit 10 to be operable to suppress dew condensation on the plurality of heat transfer members 14. Dew condensation on the plurality of heat transfer members 14 can then be suppressed by appropriately setting the size of the spacing 24, the insulation performance of the support member 68, and the like.

Although the heat insulating member 16 illustrated in FIG. 1 have included the insulating case 26 and insulating layer 28, the heat insulating member 16 may include only either of the insulating case 26 and insulating layer 28. When the heat insulating member 16 does not include the insulating case 26, the cooling member 12 may be entirely covered by the insulating layer 28 and other insulating layers.

If each of the plurality of heat transfer members 14 is independently movable from a position distant from the cooling surface 12A to a position in touch with the cooling surface 12A, the support member 18 may not be structured so as to elastically support the plurality of heat transfer members 14.

Although the cooling member 12 has been cooled by the coolant 22, the cooling member 12 may be cooled by another cooling body such as, for example, a Peltier device. Although the cooling member 12 has been shaped like a box, the cooling member 12 may have another shape.

Although the target to be cooled by the cooling member 12 has been the electronic apparatus 38, another apparatus may be cooled.

Next, an electronic apparatus system according to an embodiment, which has the cooling unit 10 described above, will be described.

The electronic apparatus system 40 illustrated in FIG. 8 is a combination of a plurality of cooling units 10 and electronic apparatuses 38 described above. Specifically, the electronic apparatus system 40 includes cooling units 10A to 10C and electronic apparatuses 38A to 38C. The cooling units 10A to 10C have the same structure.

However, the electronic apparatuses 38A to 38C have different sizes. Specifically, the electronic apparatus 38A is larger than the electronic apparatuses 38B and 38C. The size and shape of the electronic apparatus 38A are such that it comes into contact with all of the plurality of heat transfer members 14. By contrast, the sizes and shapes of the electronic apparatuses 38B and 38C are such that they come into contact with a plurality of heat transfer members 14 excluding some heat transfer members 14. The electronic apparatus 38C is smaller than the electronic apparatus 38B and comes into contact with less heat transfer members 14 than the electronic apparatus 38B.

In the electronic apparatus system 40, the electronic apparatuses 38A to 38C are cooled in a state in which the electronic apparatuses 38A to 38C are respectively set to the cooling units 10A to 10C, as in the example illustrated in FIG. 2. Specifically, when the electronic apparatus 38A is pressed toward the cooling surface 12A with the electronic apparatus 38A in contact with all heat transfer members 14 of the cooling unit 10A, all heat transfer members 14 come into contact with the cooling surface 12A. The electronic apparatus 38A is thereby cooled.

When the electronic apparatus 38B is pressed toward the cooling surface 12A with the electronic apparatus 38B in contact with some of the plurality of heat transfer members 14 of the cooling unit 10B, the some heat transfer members 14 come into contact with the cooling surface 12A. The electronic apparatus 38B is thereby cooled. Similarly, when the electronic apparatus 38C is pressed toward the cooling surface 12A with the electronic apparatus 38C in contact with some of the plurality of heat transfer members 14 of the cooling unit 10C, the some heat transfer members 14 come into contact with the cooling surface 12A. The electronic apparatus 38C is thereby cooled.

Accordingly, the electronic apparatus system 40 can cool the electronic apparatuses 38A to 38C having different shapes and sizes by using the cooling units 10A to 10C having the same structure. If the cooling units 10A to 10C are made the same, therefore, costs can be reduced in comparison with the use of a plurality of different cooling units.

In the electronic apparatus system 40, as illustrated in FIG. 9, the electronic apparatuses 38A to 38C may include main bodies 80A to 80C having a heat generating body and heat dissipating members 82A to 82C, which are respectively connected to the main bodies 80A to 80C so as to be heat transferable. The main bodies 80A to 80C have the same size, but generate heat at different temperatures in different areas.

The heat dissipating members 82A to 82C, formed in a block shape, are formed in different sizes according to the heat generating temperatures and heat generating areas of the main bodies 80A to 80C. Specifically, the heat dissipating member 82A is larger than the heat dissipating members 82B and 82C. The size and shape of the heat dissipating member 82A are such that it comes into contact with all of the plurality of heat transfer members 14. By contrast, the sizes and shapes of the heat dissipating members 82B and 82C are such that they come into contact with the plurality of heat transfer members 14 excluding some heat transfer members 14. The heat dissipating member 82C is smaller than the heat dissipating member 82B and comes into contact with less heat transfer members 14 than the heat dissipating member 82B. The heights of the main bodies 80A to 80C from the heat dissipating members 82A to 82C are larger than the spacing 24 illustrated in FIG. 1.

In the electronic apparatus system 40, the electronic apparatuses 38A to 38C are cooled in a state in which the electronic apparatuses 38A to 38C are respectively set to the cooling units 10A to 10C, as in the example illustrated in FIG. 8. Specifically, when the electronic apparatus 38A is pressed toward the cooling surface 12A with the heat dissipating member 82A in contact with all heat transfer members 14 of the cooling unit 10A, all heat transfer members 14 come into contact with the cooling surface 12A. The heat dissipating member 82A and main body 80A are thereby cooled.

When the electronic apparatus 38B is pressed toward the cooling surface 12A with the heat dissipating member 82B in contact with some of the plurality of heat transfer members 14 of the cooling unit 10B, the some heat transfer members 14 come into contact with the cooling surface 12A. The heat dissipating member 82B and main body 80B are thereby cooled. Similarly, when the electronic apparatus 38C is pressed toward the cooling surface 12A with the heat dissipating member 82C in contact with some of the plurality of heat transfer members 14 of the cooling unit 10C, the some heat transfer members 14 come into contact with the cooling surface 12A. The heat dissipating member 82C and main body 80C are thereby cooled.

When the size of the main bodies 82A to 82C are changed according to the heat generating temperatures and heat generating areas of the main bodies 80A to 80C, the main bodies 80A to 80C can be cooled to appropriate temperatures according to their heat generating temperatures and heat generating areas.

The heat dissipating members 82A to 82C may be integrated into the main bodies 80A to 80C. Alternatively, the heat dissipating members 82A to 82C may be formed separately from the main bodies 80A to 80C and then secured to them with a heat transfer member having a heat transfer property and adhesive property.

The electronic apparatuses 38A to 38C may be any one of the electronic apparatuses 38 illustrated in FIGS. 10A to 10D. In these electronic apparatuses 38A to 38C, the heat dissipating members 82A to 82C each have a plurality of heat dissipating blocks 84, each of which has the same structure. The plurality of heat dissipating blocks 84 are preferably placed according to the heat generating temperature and heat generating area of the main body 80. The use of the heat dissipating blocks 84 having the same structure then enables the shape or size of the heat dissipating member 82 to be changed according to the heat generating temperature and heat generating area of the main body 80, with reduced costs.

Although the electronic apparatus system 40 illustrated in FIGS. 8 and 9 have included the plurality of cooling units 10A to 10C and the plurality of electronic apparatuses 38A to 38C, the electronic apparatus system 40 may include one cooling unit 10 and one electronic apparatus 38 illustrated in FIGS. 1 to 7.

All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention. 

1. A cooling unit comprising: a cooling member cooled by a cooling body; a plurality of heat transfer members, each of the plurality of heat transfer members having a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with a target to be cooled; and a support member that supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.
 2. The cooling unit according to claim 1, further comprising: a heat insulating member that thermally isolates the cooling member.
 3. The cooling unit according to claim 1, wherein the support member thermally isolates the cooling member.
 4. The cooling unit according to claim 3, wherein the support member forms a sealed spacing between the cooling member and the plurality of heat transfer members.
 5. The cooling unit according to claim 2, wherein the heat insulating member includes an isolating case accommodating the cooling member, the isolating case having a hole that passes through the isolating case in a direction in which the plurality of heat transfer members move toward and away from the cooling member, and wherein the plurality of heat transfer members are disposed inside an outer periphery of the hole.
 6. The cooling unit according to claim 2, wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and wherein the support member includes a plurality of thermally insulative support bodies supporting the plurality of heat transfer members, each of the plurality of thermally insulative support bodies being formed so as to enclose a periphery of one of the plurality of through-holes and forming an individual sealed spacing between the cooling member and the one of the plurality of heat transfer members.
 7. The cooling unit according to claim 2, wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and wherein the support member includes a thermally insulative support body supporting the plurality of heat transfer members, the thermally insulative support body being disposed at an opposite side of the insulating layer from the cooling member at a distance from the insulating layer and forming a sealed spacing between the cooling member and the plurality of heat transfer members.
 8. An electronic apparatus system comprising: an electronic apparatus that is a target to be cooled; and a cooling unit that includes: a cooling member cooled by a cooling body, a plurality of heat transfer members, each of the plurality of heat transfer members having a first contact portion and a second contact portion, the first contact portion being configured to come into contact with the cooling member, the second contact portion being configured to come into contact with the electronic apparatus, and a support member that supports the plurality of heat transfer members at positions distant from the cooling member so that each of the plurality of heat transfer members is independently movable to be in contact with the cooling member.
 9. The electronic apparatus system according to claim 8, the cooling unit further including a heat insulating member that thermally isolates the cooling member.
 10. The electronic apparatus system according to claim 8, wherein the support member thermally isolates the cooling member.
 11. The electronic apparatus system according to claim 10, wherein the support member forms a sealed spacing between the cooling member and the plurality of heat transfer members.
 12. The electronic apparatus system according to claim 9, wherein the heat insulating member includes an isolating case accommodating the cooling member, the isolating case having a hole that passes through the isolating case in a direction in which the plurality of heat transfer members move toward and away from the cooling member, and wherein the plurality of heat transfer members are disposed inside an outer periphery of the hole.
 13. The electronic apparatus system according to claim 9, wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and wherein the support member includes a plurality of thermally insulative support bodies supporting the plurality of heat transfer members, each of the plurality of thermally insulative support bodies being formed so as to enclose a periphery of one of the plurality of through-holes and forming an individual sealed spacing between the cooling member and the one of the plurality of heat transfer members.
 14. The electronic apparatus system according to claim 9, wherein the heat insulating member includes an insulating layer disposed on a surface of the cooling member and having a plurality of through-holes, the surface facing the plurality of heat transfer members, each of the plurality of through-holes being formed at a position corresponding to one of the plurality of heat transfer members, and wherein the support member includes a thermally insulative support body supporting the plurality of heat transfer members, the thermally insulative support body being disposed at an opposite side of the insulating layer from the cooling member at a distance from the insulating layer and forming a sealed spacing between the cooling member and the plurality of heat transfer members. 